Table 2 Dimensions and thermal properties of different package layers
From: Research of thermal sensor allocation and placement based on dual clustering for microprocessors
Layer | Area (mm 2) | Thickness ( mm) | Mesh length ( mm) | Specific heat ( J/ kg°C) | Density ( kg/m 3) | Thermal conductivity ( W/ m°C) |
|---|---|---|---|---|---|---|
Die | 10 × 10 | 0.8 | 0.08 | 712 | 2330 | 148 |
TIM1 | 10 × 10 | 0.4 | 0.08 | 230 | 7310 | 30 |
IHS | 30 × 30 | 2.4 | 0.2 | 385 | 8930 | 390 |
TIM2 | 30 × 30 | 0.4 | 0.2 | 2890 | 900 | 6.4 |
HeatSink | 60 × 60 | 6.4 | 0.4 | 385 | 8930 | 360 |